Analytical Model for Simulating the Thermal Behavior of Microelectronic Systems
نویسندگان
چکیده
An analytically ANALYTICAL MODEL FOR SIMULATING THE THERMAL BEHAVIOR OF MICROELECTRONIC SYSTEMS P. Teertstra, J.R. Culham and M.M. Yovanovich Microelectronics Heat Transfer Laboratory Department of Mechanical Engineering University of Waterloo Waterloo, Ontario, Canada N2L 3G1
منابع مشابه
Thermal expansion behavior of through-silicon-via structures in three-dimensional microelectronic packaging
0026-2714/$ see front matter 2011 Elsevier Ltd. A doi:10.1016/j.microrel.2011.11.001 ⇑ Corresponding author. E-mail address: [email protected] (Y.-L. Shen). Thermo-mechanical reliability is an important issue for the development and deployment of the throughsilicon-via (TSV) technology in three-dimensional (3D) microelectronic packaging. The mismatch in coefficient of thermal expansion (CTE) betwe...
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تاریخ انتشار 1996